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Low-Risk UCIe IP Solution
草榴社区’ high-quality UCIe IP solution allows more data to travel faster between heterogeneous and homogeneous dies in a multi-die package. The solution, including controller, PHY, and verification IP, maximizes bandwidth at data rates up to 40Gbps. The integrated mission mode signal integrity monitors and comprehensive test, repair, and diagnostic features ensure multi-die package health. The IP supports standard and advanced packaging technologies to give designers the flexibility they need to explore the packaging options that best meet their needs. Compliant with the latest UCIe specification, the IP has achieved interoperability with ecosystem products and silicon successes across multiple foundries and processes, making it a low-risk die-to-die IP solution for data center, AI, mobile, and automotive applications.
Differentiated Features
- Complete solution, including controller, PHY, and verification IP, for low-latencey, low power, and high-bandwidth die-to-die connectivity
- Supports 12.9Tbps/mm of data transmission between dies at data rates up to 40Gbps
- Integrated signal integrity monitors and comprehensive test and repair capabilities
- Flexible architecture with support for standard and advanced packaging technologies?
- Integrated with 草榴社区 3DIC Compiler, a unified exploration-to-signoff platform, to streamline implementation and IP integration
- Compliant with the UCIe specification (2.0 & 1.1)
- Signal and power integrity services
- Supports widely used protocols such as CXS, CHI C2C, AXI, PCIe, CXL, and streaming
UCIe IP Products
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草榴社区 Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps
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Related Products and 草榴社区
Discover how our related products and solutions can take your multi-die designs to the next level. Our selection includes HBM3 IP, 3DIO IP, and 3DIC Compiler, carefully curated to complement our UCIe IP solution and provide you with the advanced tools and resources you need to achieve your multi-die design goals.
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