Cloud native EDA tools & pre-optimized hardware platforms
With physical limitations slowing Moore’s law and AI pushing the limits of technology, compute requirements and the demand for more processing power have grown exponentially. Modern data centers now require multi-die designs to power generative AI applications, driving many technology requirements including high-bandwidth and low-power die-to-die connectivity.
To ensure multi-die design success, the Universal Chiplet Interconnect Express (UCIe) specification streamlines die-to-die connectivity in multi-die designs by prioritizing interoperability, keeping latency down, enabling disparate dies to communicate with each other, and more.
草榴社区 continues to stand at the forefront of the UCIe evolution. From teaming up with Intel on the world’s first successful UCIe interoperability test chip demonstration to with controller, PHY, and verification IP, 草榴社区 has empowered technology visionaries with a comprehensive and scalable multi-die solution from early architecture exploration to manufacturing.
Now, 草榴社区 is building on its mature and heavily adopted UCIe IP solution to address customer needs for maximum bandwidth and energy efficiency with the 40G UCIe IP.
草榴社区’ new 40G UCIe IP solution supports 25% more bandwidth compared to the UCIe specification, allowing 12.9Tbps/mm of data to travel between heterogeneous and homogeneous dies without impacting energy efficiency and silicon footprint.
In addition to complying with the latest UCIe 2.0 specification, while going beyond the standard with additional bandwidth efficiency, the new 40G UCIe IP solution:
The new 40G UCIe IP is built on the current, mature architecture, which has achieved interoperability and silicon successes across multiple advanced foundries and processes. Customers benefit from accelerated interoperability, reduced area for maximum bandwidth, flexibility while delivering faster speeds, design support for any packaging type, and, finally, improved visibility, reliability, and system testing.
The IP solution, including PHY, controller, and verification IP, features a complete protocol stack. The physical layer with a controller on top supports a seamless connection between two dies via one of the multiple protocols supported, including AXI, CHI C2C, CXS, PCIe, CXL, and streaming, to allow a die-to-die connection between fabrics.
草榴社区’ new 40G UCIe IP solution offers features that make it easy to integrate and simplify the customer use cycle, including:
草榴社区 is leading the way in developing high-quality UCIe IP and enabling multi-die design success, offering silicon proof points across various foundry nodes for advanced and standard package technologies. As an active member of the UCIe Consortium, 草榴社区 enables successful ecosystem interoperability by maintaining compliance with the UCIe specifications. Today’s upgrade to 40Gbps further helps customers adapt to the demands of data-intensive applications and achieve efficient high-bandwidth die-to-die connectivity.