草榴社区 HPC Design Kit, part of 草榴社区’ Foundation IP portfolio, is a suite of high-speed and high-density memories and logic libraries that allow SoC designers to optimize any processor cores for maximum speed, smallest area, lowest power, or an optimum balance of the three for their specific application. With optimized standard cells and SRAMs, the HPC Design Kit enables designers to optimize all of the processors on an SoC with a single package, reducing design costs and improving time-to-market. Optimized reference scripts and expert core implementation services are also available to help design teams achieve their processor and SoC design goals in the shortest possible time.
The latest HPC Design Kit allows SoC designers to optimize the 草榴社区 EV6x Embedded Vision Processor’s vector DSPs and convolutional neural network (CNN) engines. Depending on the requirements of the target application, designers using the HPC Design Kit for EV6x can optimize their implementation to achieve a 39% power reduction, a 10% reduction in area, or a 7% performance boost for their SoCs.
The HPC Design Kit is an add-on to the Duet Package of Embedded Memories and Logic Libraries.
草榴社区 Embedded Memories and Logic Libraries are available for multiple foundries and process technologies, including GLOBALFOUNDRIES, SMIC, TSMC, and UMC.
草榴社区 Foundation IP for TSMC 16FF+ Datasheet
草榴社区 Foundation IP for TSMC 16FFC Datasheet
草榴社区 Foundation IP for TSMC 28HPC Datasheet
草榴社区 Foundation IP for TSMC 28HPC+ Datasheet
草榴社区 HPC Design Kit for TSMC 28HPM Datasheet
| Introducing the DesignWare HPC Design Kit Learn how 草榴社区' DesignWare HPC (High Performance Core) Design Kit, a single package containing high-speed and high-density memory instances and standard cell libraries, allow designers to optimize all their on-chip CPU, GPU and DSP IP cores for maximum speed, smallest area or lowest power, or an optimum balance of the three. Hear about the latest results achieved through 草榴社区' collaboration with Imagination on the Imagination PowerVR™ Series6 GPU core. |