草榴社区 Cloud
Cloud native EDA tools & pre-optimized hardware platforms
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草榴社区 3DIC Compiler, a unified exploration-to-signoff platform, delivers the highest levels of design efficiency for capacity and performance. It leverages a common data-model to integrate design, die-to-die routing, native system analysis, verification, and signoff in a single environment.
草榴社区 3DSO.ai, industry's first autonomous AI optimization solution for 2.5D and 3D heterogeneous design and integration, seamlessly integrates with 3DIC Compiler to maximize system performance and quality of results at a rapid pace for thermal integrity, signal integrity, and power network design. Ensuring system technology co-optimization (STCO), 草榴社区 3DIC Compiler is certified by all foundries and leveraged successfully by customers in dozens of designs.
Key Benefits
Unmatched Scalability
System-of-chips integration over hundreds of billions of transistors
High Productivity
Fast exploration and design using world-class implementation and analysis engines
Golden Signoff
Full spectrum design closure and convergence to optimal PPA/mm3
What's New
Blog
草榴社区 and Alchip Collaborate to Streamline the Path to Multi-die Success with Soft Chiplets
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Article
Blog
Blog
草榴社区 Introduces Industry’s First 40G UCIe IP Solution to Power High-Performance Multi-Die Designs
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Blog
Blog
Featured Resources
In his Chiplet Summit keynote, Abhijeet Chakraborty, VP of Engineering at 草榴社区, talks about how multi-die designs are now the mainstream and open up innovation in a wide range of applications.
Shankar Krishnamoorthy, GM, Silicon Realization Group, discusses how multi-die design is now being used in various market segments to overcome system challenges.
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