²ÝÁñÉçÇø

²ÝÁñÉçÇø 3DIC Compiler, a unified exploration-to-signoff platform, delivers the highest levels of design efficiency for capacity and performance. It leverages a common data-model to integrate design, die-to-die routing, native system analysis, verification, and signoff in a single environment.

²ÝÁñÉçÇø 3DSO.ai, industry's first autonomous AI optimization solution for 2.5D and 3D heterogeneous design and integration, seamlessly integrates with 3DIC Compiler to maximize system performance and quality of results at a rapid pace for thermal integrity, signal integrity, and power network design. Ensuring system technology co-optimization (STCO), ²ÝÁñÉçÇø 3DIC Compiler is certified by all foundries and leveraged successfully by customers in dozens of designs.