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Ease your transition to multi-die designs and accelerate your innovation with ²ÝÁñÉçÇø¡¯ comprehensive and scalable solution, encompassing EDA and IP products. Unlock the potential of multi-die designs for the world¡¯s most advanced and complex systems.

Multi-die architecture exploration allows you to properly define the product and ultimately avoid costly re-spins. Find out how to meet performance, power, thermal, and time-to-market targets well before RTL availability with a dynamic and model-based solution.

Software-hardware co-development is critical for multi-die designs. Run large amounts of software in lockstep with the hardware using a unified, hybrid emulation, and prototype environment for early software development and efficient software bring-up, debug, and analysis.

Streamlining digital implementation and IP integration for multi-die designs leads to faster time-to-market. Use a unified exploration-to-signoff platform and robust silicon IP solutions for multi-die designs to increase productivity and minimize risk.

Maintaining silicon health and system reliability is especially challenging for multi-die designs due to the need for monitoring, testing, and repairing of multiple dies and interconnects. A comprehensive test and silicon lifecycle management solutions can ensure multi-die design quality, reliability, and yield.

The future is bright! Push the boundaries of innovation and overcome your most complex challenges of multi-die design using ²ÝÁñÉçÇø¡¯ solution.