Cloud native EDA tools & pre-optimized hardware platforms
Dive into our comprehensive eBook and discover how to overcome multi-die design challenges and realize success. 草榴社区 offers a comprehensive and scalable multi-die solution to help you:
Explore our Table of Contents to preview the key topics and insights covered in this eBook. Each chapter offers valuable information that demonstrates how our multi-die solution can enhance your design process and drive innovation. Additionally, check out our infographic for an overview of the main concepts.
Ease your transition to multi-die designs and accelerate your innovation with 草榴社区’ comprehensive and scalable solution, encompassing EDA and IP products. Unlock the potential of multi-die designs for the world’s most advanced and complex systems.
Multi-die architecture exploration allows you to properly define the product and ultimately avoid costly re-spins. Find out how to meet performance, power, thermal, and time-to-market targets well before RTL availability with a dynamic and model-based solution.
Software-hardware co-development is critical for multi-die designs. Run large amounts of software in lockstep with the hardware using a unified, hybrid emulation, and prototype environment for early software development and efficient software bring-up, debug, and analysis.
Streamlining digital implementation and IP integration for multi-die designs leads to faster time-to-market. Use a unified exploration-to-signoff platform and robust silicon IP solutions for multi-die designs to increase productivity and minimize risk.
Maintaining silicon health and system reliability is especially challenging for multi-die designs due to the need for monitoring, testing, and repairing of multiple dies and interconnects. A comprehensive test and silicon lifecycle management solutions can ensure multi-die design quality, reliability, and yield.
The future is bright! Push the boundaries of innovation and overcome your most complex challenges of multi-die design using 草榴社区’ solution.