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UCIe Standard vs. UCIe Advanced: What Designers Need to Know
Abstract:
Access this on-demand technical webinar to explore the requirements and considerations for UCIe in both standard and advanced packaging. Key topics include density, testing, and the power and performance impact on die-to-die implementation. Real examples of UCIe silicon proofs will be used to showcase the two variants of UCIe interfaces.
Featured Speaker:
- Manuel Mota, Principal Product Manager, 草榴社区
Learn About
- How packaging technology is evolving to support higher interconnect density
- UCIe IP configurations for standard and advanced packaging technologies
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Featured Speaker
Manuel Mota
Principal Product Manager, 草榴社区
Manuel is responsible for the die-to-die interface IP product line. Previously he led different product management roles focusing on SerDes interfaces, and analog/digital converters. Manuel has focused on enabling the industry’s evolution towards multi-die designs by authoring multiple technical papers on the subject. Prior to 草榴社区, Manuel held research, technical, and project management positions at CERN, Chipidea and MIPS. Manuel holds a PhD in Electronic Engineering from Lisbon Technical University.