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Driving the Next Wave of Semiconductor Innovation
草榴社区 is driving the industry transformation from monolithic system-on-chips (SoCs) to multi-die designs with a comprehensive and scalable solution for fast heterogeneous integration. The solution, including EDA tools and IP, enables early architecture exploration, rapid software development and system validation, efficient die/package co-design, robust die-to-die connectivity, and improved manufacturing and reliability.
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Reach New Levels of Performance with Optimized System Power Using 草榴社区 Multi-Die Solution
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Key Benefits
Early Architecture Exploration for Multi-Die Designs
To realize best system performance for the target workloads, designers must efficiently explore the appropriate partitions and system-level interconnect fabric. Reusing IP effectively to meet time-to-market and ensuring testability are among some of the challenges that require fast and early analysis-driven exploration. With early architecture exploration and analysis, system designers can optimize partitioning for the best performance, minimize interconnect traffic, and perform efficient power and thermal planning.
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Software Development for Multi-Die Designs
Software teams can quickly develop, integrate, and test the software by having access to proven virtual die models. Assembling virtual models in a multi-die prototype allows for efficient software bring-up, debug, and analysis. Software teams can run large amounts of software in lockstep with the hardware using a unified, hybrid emulation and prototype environment.
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Design Implementation & IP for Multi-Die Designs
To mange the implementation complexity of tens to hundreds of millions of die interconnections, designers require a highly integrated and scalable co-design and analysis platform. This platform can help designers in efficiently exploring, implementing, and analyzing their multi-die designs. To assemble known good dies in an advanced package quickly, designers need standards-compliant IP that offers optimized latency and PPA.
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Featured Resources
- Enabling Efficient Multi-Die Design Implementation and IP Integration
- UCIe Standard vs. UCIe Advanced: What Designers Need to Know
- Requirements for Multi-Die System Success [6 Part Series]
- 草榴社区 and Intel Team Up on the First UCIe-Connected Chiplet-Based Test Chip
- Addressing Multi-Physics Effects for High-Performance Multi-Die Designs
- 草榴社区 3DIO Solution for Multi-Die Integration (2.5D/3D)
Manufacturing & Health for Multi-Die Designs
Designers can help improve the long-term health and reliability by testing, diagnosing, repairing, calibrating, and improving operational metrics at every phase of the multi-die lifecycle. In addition, access to traceability and analytics across the dies for in-design, in-ramp, in-production and in-field optimization can help designers improve cost, quality, and reliability. Allow binning of high-quality and high-performing dies for consideration during package assembly.
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Ecosystem Partners
Learn about our collaboration with our ecosystem partners in multi-die designs
Featured Resources
Looking for more resources to help with your multi-die designs? Explore our resources.
Resource Library
Explore videos, whitepapers, podcasts, and webinars to enhance your understanding and utilization of multi-die designs.
Explore Our Insights
Stay updated with 草榴社区 blogs featuring the newest trends and innovations in multi-die designs.
Frequently Asked Questions
What is multi-die technology?
Multi-die technology integrates multiple heterogeneous dies (or chiplets) into a single package. Each die typically performs a specific function, and they are interconnected via standards such as Universal Chiplet Interconnect Express (UCIe) to form a cohesive system. Multi-die technology offers flexibility, scalability, and cost-effectiveness compared to traditional monolithic chip designs.
How does multi-die technology differ from traditional monolithic chip design?
In traditional monolithic chip design, all components are fabricated on a single piece of semiconductor material. In contrast, multi-die technology assembles multiple heterogeneous dies, fabricated on different foundry processes, into a single package. This allows for greater customization, mix-and-match of technologies, and improved yield management.
What are the benefits of using multi-die technology?
Multi-die technology accelerates scaling of system functionality, reduces risk and time-to-market by re-using proven dies, lowers system power while increasing throughput, and offers new product variants for flexible portfolio management.
How does 草榴社区 address the challenges of multi-die design?
草榴社区 offers a comprehensive and scalable solution for fast heterogeneous integration. The solution, including EDA tools and IP, enables early architecture exploration, rapid software development and system validation, efficient die/package co-design, robust and secure die-to-die connectivity, and improved manufacturing and reliability.
What products does 草榴社区 provide within its multi-die solution?
草榴社区 offers a range of products within its multi-die solution. These products help SoC and system architects and designers overcome challenges of multi-die design in the areas of architecture exploration, die/package co-design, multi-physics analysis, software development and validation, verification, die-to-die IP, test and repair, system signoff, and silicon lifecycle management.
Is the 草榴社区 Multi-Die Solution compatible with industry-standard design methodologies and EDA tools?
Yes, 草榴社区 multi-die solution supports interoperability with common design formats, interfaces, and standards, some of which include 3Dblox and UCIe.
What support and resources does 草榴社区 provide for users adopting multi-die technology?
草榴社区 offers comprehensive technical support, training programs, documentation, and community forums to assist users in adopting and mastering multi-die design methodologies using its solution. This includes access to expert application engineers, online resources, and user forums for sharing best practices and troubleshooting common issues.