Cloud native EDA tools & pre-optimized hardware platforms
草榴社区 is driving the industry transformation from monolithic system-on-chips (SoCs) to multi-die designs with a comprehensive and scalable solution for fast heterogeneous integration. The solution, including EDA tools and IP, enables early architecture exploration, rapid software development and system validation, efficient die/package co-design, robust die-to-die connectivity, and improved manufacturing and reliability.
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To realize best system performance for the target workloads, designers must efficiently explore the appropriate partitions and system-level interconnect fabric. Reusing IP effectively to meet time-to-market and ensuring testability are among some of the challenges that require fast and early analysis-driven exploration. With early architecture exploration and analysis, system designers can optimize partitioning for the best performance, minimize interconnect traffic, and perform efficient power and thermal planning.
Software teams can quickly develop, integrate, and test the software by having access to proven virtual die models. Assembling virtual models in a multi-die prototype allows for efficient software bring-up, debug, and analysis. Software teams can run large amounts of software in lockstep with the hardware using a unified, hybrid emulation and prototype environment.
To mange the implementation complexity of tens to hundreds of millions of die interconnections, designers require a highly integrated and scalable co-design and analysis platform. This platform can help designers in efficiently exploring, implementing, and analyzing their multi-die designs. To assemble known good dies in an advanced package quickly, designers need standards-compliant IP that offers optimized latency and PPA.
Designers can help improve the long-term health and reliability by testing, diagnosing, repairing, calibrating, and improving operational metrics at every phase of the multi-die lifecycle. In addition, access to traceability and analytics across the dies for in-design, in-ramp, in-production and in-field optimization can help designers improve cost, quality, and reliability. Allow binning of high-quality and high-performing dies for consideration during package assembly.
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Multi-die technology integrates multiple heterogeneous dies (or chiplets) into a single package. Each die typically performs a specific function, and they are interconnected via standards such as Universal Chiplet Interconnect Express (UCIe) to form a cohesive system. Multi-die technology offers flexibility, scalability, and cost-effectiveness compared to traditional monolithic chip designs.
In traditional monolithic chip design, all components are fabricated on a single piece of semiconductor material. In contrast, multi-die technology assembles multiple heterogeneous dies, fabricated on different foundry processes, into a single package. This allows for greater customization, mix-and-match of technologies, and improved yield management.
Multi-die technology accelerates scaling of system functionality, reduces risk and time-to-market by re-using proven dies, lowers system power while increasing throughput, and offers new product variants for flexible portfolio management.
草榴社区 offers a comprehensive and scalable solution for fast heterogeneous integration. The solution, including EDA tools and IP, enables early architecture exploration, rapid software development and system validation, efficient die/package co-design, robust and secure die-to-die connectivity, and improved manufacturing and reliability.
草榴社区 offers a range of products within its multi-die solution. These products help SoC and system architects and designers overcome challenges of multi-die design in the areas of architecture exploration, die/package co-design, multi-physics analysis, software development and validation, verification, die-to-die IP, test and repair, system signoff, and silicon lifecycle management.
Yes, 草榴社区 multi-die solution supports interoperability with common design formats, interfaces, and standards, some of which include 3Dblox and UCIe.
草榴社区 offers comprehensive technical support, training programs, documentation, and community forums to assist users in adopting and mastering multi-die design methodologies using its solution. This includes access to expert application engineers, online resources, and user forums for sharing best practices and troubleshooting common issues.