As a technology leader, you are looking for a competitive edge to deliver high-performance computing (HPC) SoCs and systems with the highest compute, fastest connectivity, and most efficient storage capabilities. Processing high volumes of data with minimum power consumption for unique workloads are now requiring advanced process node, high-speed SerDes IP and 2.5D or 3D packaging technologies. In addition, to keep up with today’s fast-moving HPC innovations, accelerating time-to-market with hardware/software co-optimization and early architectural exploration has become a top priority. 草榴社区 helps optimize design, improve productivity, and obtain the necessary expertise you need to deliver reliable, secure and high-quality HPC and data center SoCs and systems.
Access a comprehensive solution for the entire design journey
Meet system targets for power, performance, area, latency, security and reliability
Accelerate design schedules with early hardware/software co-design and architectural explorations
With a comprehensive and seamless HPC and data center solution, 草榴社区 allows access to the most essential technologies for design and implementation, silicon IP, optical interconnects and verification from silicon to software. The solution helps you deliver designs with maximum security, reliability and power efficiency while allowing fast heterogeneous 2.5D & 3D system integration in advanced packaging technologies. 草榴社区 is collaborating with leading ecosystem partners to enhance the solution with specific capabilities to help you achieve silicon success for HPC and data center applications such as AI, server, edge computing, networking and storage.?
草榴社区 helps you deliver innovative HPC and data center systems with optimized design targets. The 草榴社区 end-to-end solution consists of a broad portfolio of low-latency, silicon-proven IP along with SoC architectural exploration-to-signoff platforms to help optimize for power, area, yield, and high throughput. In addition, designers can leverage 草榴社区’ 3DIC solution to achieve higher levels of system integration for multi-die system-in-a-package. To address security concerns, 草榴社区 offers comprehensive hardware and software solutions. To meet reliability at each phase of the device lifecycle, 草榴社区 provides an integrated solution for real-time monitoring and data-driven analytics.
To help improve your team’s productivity, 草榴社区’ end-to-end HPC and data center solution provides an AI-driven platform for chip design. In addition, the solution enables early architectural exploration and software development for hardware/software co-design and early RTL exploration for improved productivity across the entire RTL-to-GDSII flow. Your engineers can focus on their core technical competencies by leveraging 草榴社区’ system design services, which allows efficient SoC design, IP hardening and system optimization.
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Achieve early RTL exploration for domain-specific architectures, optimize SoC PPA and improve designer productivity across entire RTL-to-GDSII flow with comprehensive design platform
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Fusion Design Platform | DSO.ai | Silicon Lifecycle Management | 3DIC Solution | Photonics Design
Explore architecture and early software development with virtual prototyping and enable HW/SW co-design using the latest protocol models and fastest SoC and system verification platforms
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Virtual Prototyping | HAPS | ZeBu | VCS | VC Formal | Verdi | Verification IP | VC SpyGlass
Deliver advanced HPC and Data Center SoCs for server, networking, storage, visual computing, edge infrastructure, AI with broadest portfolio of high-performance, low-latency & power-efficient IP
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IP for HPC & Data Center SoCs
Ensure security starting at SoC with comprehensive HW/SW solutions to protect data & communications; Improve silicon & system reliability, optimize performance with real-time monitoring & data driven analytics
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Security IP | Silicon Lifecycle Management
Achieve fast 2.5D & 3D heterogeneous system design and integration supporting capacity and performance scalability using a unified 3DIC exploration-to-signoff platform
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3DIC Solution
Meet complex system requirements faster and improve quality of results leveraging AI-driven chip design solution, optimized IP portfolio and AI industry experts
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DSO.ai | IP for Artificial Intelligence SoCs
Build energy efficient SoCs with a software-driven low power exploration, analysis and optimization flow from architecture to signoff
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Low-Power Design Flow
Deliver differentiated SoCs for segment-specific requirements from system design thru silicon implementation with System-Metric Driven Design methodologies
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System Design 草榴社区
