Cloud native EDA tools & pre-optimized hardware platforms
DesignCon is the premier high-speed communications and system design conference, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley.?Attend the event to network with 草榴社区’ experts and see several successful interoperability demonstrations of 草榴社区’ 224G Ethernet IP, PCIe 7.0, and USB4 in our partner booths. Don’t miss the panels on PCIe 7.0 and electro-optical interconnects with 草榴社区 and other industry experts.
Terasignal and 草榴社区 demonstrate the world’s first optical diagnostic interoperability at 112Gbps for next-gen energy efficient interconnects
Anritsu’s Booth #907
Foxconn’s Booth #913
Keysight’s Booth #1039
Samtec’s Booth #1039
Teledyne LeCroy’s Booth #513
Yamaichi’s Booth #758
PCI Express & PAM4: Balancing Silicon & Interconnect Interdependencies for 128 GT/s
Tuesday, January 28 ? 4:45 PM - 6:00 PM Pacific Time (US & Canada)
Join industry leaders from 草榴社区, Keysight, BitifEye, Amphenol, Samtec and Intel for an in-depth conversation focusing on the latest updates and changes to PCIe signaling and physical topologies, focusing on the PAM4 signaling in the PCIe 7.0 specification.
Learn more
Linear Electro Optical Interfaces: What, Why, When & How?
Wednesday, January 29 ? 3:15 PM - 4:00 PM Pacific Time (US & Canada)
This session will introduce and explain linear electro-optical links, a rapidly growing E/O interface for the next-generation PCIe (6&7) and Ethernet standards (112G/224G) that not only saves overall system power but also reduces data path latency.
Learn more