草榴社区 Cloud
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Why Attend?
Learn from OIP partners how to leverage their technology for your design challenges:
- Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2/N2P, N3/N3E/N3P/N3AE, N4/N4P, N5/N5A, N6/N6e/N6RF/N7, N12e, and N22
- Latest updates on TSMC 3DFabric? chip stacking and advanced packaging processes, InFO, CoWoS?, and SoIC, 3DFabric Alliance, and 3Dblox? standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications
- Comprehensive design solutions for specialty technologies enabling ultra-low power, ultra-low voltage, analog migration, RF, mmWave, and automotive designs targeting 5G, automotive, and IoT designs
- Ecosystem specific TSMC reference flow implementations, P&R optimization, machine learn-ing to improve design quality and productivity, and cloud-based design solutions
- Successful , real-life applications of design technologies and IP solutions from TSMC's Open Innovation Platform? Ecosystem members and TSMC customers to speed up time-to-design and time-to-market
草榴社区 In-Person & Virtual Presentations | North America
In-Person Presentations:
- A Unified AI-Driven Platform for Multi-Die Exploration and Design
- Ansys-草榴社区-TSMC Solve the 3DIC Multiphysics Challenges
- Developing Next-Gen Battery Charging Technoloy Partnering with TSMC and 草榴社区 for a Sustainable Energy Future
- Effective methods to resue and automate bump creation for chiplets in 3DI designs
- Multi-die design for TSMC COUPE with unified electronic and photonic design solutions
Virtual Presentations:
- AI-based RF design synthesis flow
- AI-Driven Analog Migrations 草榴社区 Tuned for TSMC Technology Platforms
- Fast Vt skew analysis for highly accurate global variation modeling
- Leveraging TSMC's CoWoS Interposer and 草榴社区' SLM IP to Monitor, Test, and Repair Multi-Die Designs
- Revlitionizing RC Parasitic Extraction: The Power of StarRC Hybrid Extraction and GPU Accleration
- Emabling SoC Sclaing to GAA Processes with 草榴社区 Foundation IP
- Insights into the 草榴社区-TSMC UCIe IP on CoWos Test Chip
TSMC OIP Worldwide Events
North America
In-Person Experience | Sept. 25, 2024
China
In-Person Experience | Nov. 13, 2024
Japan
In-Person Experience | Oct. 25, 2024
Amsterdam
In-Person Experience | Nov. 19, 2024
Taiwan
In-Person Experience | Nov. 6, 2024
Israel
In-Person Experience | Nov. 26, 2024
草榴社区 In-Person Booth
草榴社区 Booth #204
TSMC attendees are invited to visit the 草榴社区 booth to view the latest innovative technologies and chat with 草榴社区 experts live!
Booth topics include:
- 草榴社区 IP
- AI-Driven EDA Tools
- Digital and Analog & Mixed-Signal Design
- Golden Signoff
- Physical Verification Closure,
- Silicon Lifecycle Management
- Automotive 草榴社区
