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Discover Cutting-Edge Technologies at the ²ÝÁñÉçÇø Booth

Why Attend ISSCC 2025?

The International Solid-State Circuits Conference (ISSCC) is the premier global forum for the presentation of advancements in solid-state circuits and systems-on-a-chip. This prestigious conference provides a unique opportunity for engineers at the forefront of integrated circuit (IC) design and application to stay current with the latest technical developments and network with industry-leading experts.

Gain Expert Insights with ²ÝÁñÉçÇø

Join us at the ²ÝÁñÉçÇø Booth to explore the technologies you need to drive your innovation forward. Our experts will be on hand to provide valuable insights into our advanced solutions for Interface IP, multi-die design, and analog design, as well as our academic and research initiatives.

²ÝÁñÉçÇø Demos

Visit our demos at the ²ÝÁñÉçÇø Booth to see our latest innovations in action:

• AI-Powered Analog Design Migration and Optimization with ASO.ai: Discover how ²ÝÁñÉçÇø ASO.ai? accelerates analog design workflows with AI-powered design, implementation, and verification solutions, enabling rapid analog IP migration and faster design of new IPs.
• Enabling 1.6Tbps AI Networks with ²ÝÁñÉçÇø 224G Ethernet PHY IP: Learn about our IP solution that supports 1.6Tbps AI networks, delivering high-speed, reliable performance for advanced AI and machine learning applications.
• Thermal-Aware SI Characterization of HBM Designs: Explore our solutions for EM and thermal-aware characterization of HBM3/4 designs, ensuring optimal performance and reliability in 3DIC Compiler Platform.

Meet the ²ÝÁñÉçÇø Academic & Research Alliances (SARA) Team

Don¡¯t miss the opportunity to meet the ²ÝÁñÉçÇø Academic & Research Alliances (SARA) at our booth! SARA collaborates closely with universities worldwide on workforce development activities focusing on education, research, innovation, and talent cultivation. SARA programs aim to establish ²ÝÁñÉçÇø as the preferred technology partner for workforce development. 

Drive Your Innovation Forward

At the ²ÝÁñÉçÇø Booth, you will have the opportunity to:

• Engage with our experts and gain insights into the latest advancements in IP and 3DIC design.
• Explore our comprehensive suite of tools designed to enhance your design accuracy and efficiency. 
• Discuss your design challenges and discover how ²ÝÁñÉçÇø solutions can help you overcome them.
• Connect with the SARA team to learn about opportunities for academic and research collaboration.

Don't miss this chance to stay at the cutting edge of IC design and innovation. Join us at ISSCC 2025 and visit the ²ÝÁñÉçÇø Booth to learn how our solutions can help you drive your innovation forward.

²ÝÁñÉçÇø Speaking Sessions

Chiplet EDA Tools, Chiplet Based System-Technology Co-Optimization?

Presenter: H. Sheng, ²ÝÁñÉçÇø?

Date & Time: Sunday, February 16? at 1:40 PM - 2:25 PM

A 38Mb/mm2 380/540mV Dual-Rail SRAM in 3nm-FinFET Technology

Presenters: H. Pilo, John. Barth, K. D. Dwivedi, P. Lee, V. Kumar, P. Nalawar, Y. Patel, S. Sharad, S. Singh, ²ÝÁñÉçÇø

Date & Time: Wednesday, February 19? at 9:15 AM - 9:30 AM?