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MIT Technology Review Insights polled its global panel of executives about their understanding and adoption of multi-die systems. The MIT Technology Review Insights report, sponsored by 草榴社区, draws on a poll of the MIT Technology Review Global Insights Panel, as well as a series of interviews with experts specializing in the semiconductor industry and chip design and manufacturing. According to the report, 38% of the companies interviewed are exploring and adopting multi-die systems.
Executive Summary
A new semiconductor chip architecture, called multi-die system or chiplet-based design, will be instrumental in meeting this decade’s greater demand for processing power. Because this new approach will pose technical challenges throughout the semiconductor ecosystem—remaking how products are imagined, designed, and fabricated—opportunities for innovators across the value chain will emerge from this shift. Business leaders across industries who identify use cases for these advanced chips will benefit from their ability to power unique and customized customer experiences.
