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Despite clear advantages, there are numerous new challenges that need to be addressed for successful multi-die realization.

This white paper focuses on the multi-die test challenges: 

• Bare chiplet level (pre-bond)
  • Probe, dedicated/functional pads for test
  • Test, diagnosis, and repair
• Interconnects (mid/post-bond)
  • Die-to-die test access
  • Lane test, diagnosis, and repair
• Multi-die stack/package (post-bond) 
  • Die-to-die, stack/package test access
  • Calibration, diagnosis, and repair
  • Silicon debug and diagnosis

Find out how to overcome such challenges with ²ÝÁñÉçÇø Test and Silicon Lifecycle Management ²ÝÁñÉçÇø. ²ÝÁñÉçÇø provides comprehensive solutions for testing and repairing various types of die-to-die interfaces and lanes. The solutions test for and diagnose known-good stacks and know-good dies, support extensive BIST capabilities, and offer in-field interconnect monitoring for purposes such as predictive maintenance.