草榴社区 Cloud
Cloud native EDA tools & pre-optimized hardware platforms
Request a Free Trial →
Panel Discussion: Accelerating Mainstream Adoption of Multi-Die Systems
草榴社区 recently hosted a panel of industry experts from Ansys, Bosch, Intel, and Samsung to discuss the rapid adoption of multi-die systems, what challenges lie ahead, and how companies can realize the promise of multi-die systems.
Whether you are exploring multi-die systems or implementing the architecture in your current designs, you’ll need the entire ecosystem across the semiconductor supply chain to help you make the adoption easier. Don't miss the discussion.
Register Now
Moderator & Panelists
Marco Chiappetta
Murat Becer
Michael Schaffert
Lalitha Immaneni
Cheolmin Park
