Cloud native EDA tools & pre-optimized hardware platforms
Despite the clear advantages of multi-die designs, there are numerous new challenges that stand in the way of multi-die realization.
This white paper focuses on the verification challenges of multi-die designs, including:
Find out how to overcome such challenges with 草榴社区 verification solutions. The solutions provide the industry’s best way to verify functionality, CDC and RDC correctness, power intent, and inter-die connectivity. Verification teams can make the transition to multi-die without worrying that this will make their job impossible, consume excessive compute resources, or prolong time to market.