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The shift from monolithic to multi-die design is inevitable ¡ª but that's not to say it's straightforward. Traditional monolithic design has clear limitations. Diminishing yield and high cost-per-die become issues when a design nears reticle limits. At this point, multi-die integration can break the system into a series of smaller dies and to overcome scale and cost issues of scale.

Hyperscalers and other high-performance computing companies have noted that chiplets enable collaborative design within a multi-die context that delivers cost advantages and "mix-and-match integration¡± across heterogeneous IP blocks. Unfortunately, the chiplet ecosystem has yet to be completely standardized. Chiplet-based design incurs challenges around packaging, power delivery, verification, timing, floor planning, security, testability, and thermal management.

Together with , a high-performance computing and AI ASIC company, ²ÝÁñÉçÇø addresses these issues to deliver the ROI and physical benefits of a multi-die design.

Chiplet Flexibility for Multi-Die Chip Design

This ²ÝÁñÉçÇø-Alchip collaboration combines decades of IP and EDA development and expertise. ²ÝÁñÉçÇø provides silicon-proven and complete IP such as 112G and 224G Ethernet, PCIe 6.0, PCIe 7.0, and UCIe, as well as industry-leading design and verification EDA tools. Alchip contributes its high-performance computing (HPC)-optimized physical design methodology, large-scale high-speed interface IP integration, and 2.5D advanced package design capabilities.

The growing demand for IO and memory chiplets¡ªsmall integrated circuits (IC) that combine with other chiplets to make up a bigger system-on-chip (SoC)¡ªdrives the collaboration. The process calls for carving out the functionality contained within a monolithic die and transferring it to a smaller companion unit.

The inevitable march to advanced nodes makes monolithic SoCs progressively less efficient and expensive. A standard implementation that incorporates all aspects of functionality into a single die becomes progressively harder to manage at advanced nodes. Consequently, process optimization is one reason to adopt multi-die integration; where different parts of the system¡¯s functionality may be improved on different technology nodes. A chiplet¡¯s ability to add proven functions also enhances productivity and predictability, and reduces time to market.

Under normal circumstances, partitioning functionality across different dies is a highly complicated task. The ²ÝÁñÉçÇø-Alchip solution minimizes complexity, while maximizing control with a mature, yet adaptable product, built to enable a faster development cycle. This process means the chiplet can be hardened for a specified process node and package. Configurations, die-size, and aspect ratio are also moveable. Besides shortening time-to-market, splitting monolithic SoCs frees users to concentrate on their core application-specific integrated circuit (ASIC) development. Its strength comes from combining proven technology and the abilities of two design flow specialists experienced in multi-die development. 

As the move to multi-die design gathers momentum, technological limitations will depend less on a chip's capacity. The only thing holding developers back is the ease and speed with which they can create and integrate a chiplet system that makes a user-friendly, customizable solution a valuable asset that an off-the-shelf solution simply can¡¯t beat.