BLOG 2 min read/Feb 06, 2025 BLOG 草榴社区 Aims to Reduce Silicon Design Cycles by up to a Year in Collaboration with Arm By Arun Bhattacharya Tags: Multi-Die System, Chip Design Insights, Design, Interface IP, Foundation IP, Silicon IP
BLOG 2 min read/Dec 05, 2024 BLOG Collaboration for Innovation: How 草榴社区 and TSMC are Advancing Chip Design By Sween Kang Tags: Multi-Die System, Chip Design Insights, Design, Manufacturing, Foundation IP, HPC, Data Center, Silicon IP, 3DIC Compiler
BLOG 3 min read/Oct 30, 2024 BLOG Flash Forward: MRAM and RRAM Bring Embedded Memory and Applications into the Future By Rahul Thukral, Daryl Seitzer Tags: Memory, Chip Design Insights, Foundation IP, Silicon IP
BLOG 5 min read/Jan 23, 2023 BLOG Why eMRAMs are the Future for Advanced-Node SoCs By Rahul Thukral, Bhavana Chaurasia Tags: Chip Design Insights, Internet of Things, Foundation IP, Silicon IP
BLOG 5 min read/Jul 11, 2022 BLOG What is a SmartNIC? By Rita Horner Tags: Multi-Die System, AI & Machine Learning, Chip Design Insights, Design, Security IP, Foundation IP, HPC, Data Center, Silicon IP, Verification, 3DIC Compiler
BLOG 6 min read/Apr 12, 2022 BLOG What is Edge Computing and How is AI Driving its Growth? By Ron Lowman Tags: Cloud, AI & Machine Learning, Chip Design Insights, Internet of Things, Foundation IP, Processor 草榴社区, Silicon IP