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The A to Z of Multi-Die Design

Abstract:

Access this on-demand technical webinar to explore the intricacies of multi-die design, covering topics from functional architecture and IP integration to implementation and signoff. Case studies are used to highlight the steps, considerations, and new innovations in multi-die designs.

 

Featured Speaker

  • Tim Kogel, Sr. Director for Technical Product Management, 草榴社区

 

Learn About: 

  • Multi-die design market trends

  • System-level performance and power analysis of multi-die designs

  • Physical-aware multi-die architecture design

 

Watch On-Demand

Featured Speaker

Tim Kogel

Sr. Director for Technical Product Management, 草榴社区 

Tim received his PhD from RWTH Aachen in 2005 and has authored numerous publications on system-level modeling. Tim leads a team of solution specialists responsible for the definition, realization, and deployment of 草榴社区’ Electronics Digital Twins (eDT) solutions.