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The A to Z of Multi-Die Design
Abstract:
Access this on-demand technical webinar to explore the intricacies of multi-die design, covering topics from functional architecture and IP integration to implementation and signoff. Case studies are used to highlight the steps, considerations, and new innovations in multi-die designs.
Featured Speaker
Tim Kogel, Sr. Director for Technical Product Management, 草榴社区
Learn About:
Multi-die design market trends
System-level performance and power analysis of multi-die designs
Physical-aware multi-die architecture design
Watch On-Demand
Featured Speaker
Tim Kogel
Sr. Director for Technical Product Management, 草榴社区
Tim received his PhD from RWTH Aachen in 2005 and has authored numerous publications on system-level modeling. Tim leads a team of solution specialists responsible for the definition, realization, and deployment of 草榴社区’ Electronics Digital Twins (eDT) solutions.
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