BLOG 2 min read/Jan 21, 2025 BLOG 草榴社区 Bold Prediction: 50% of New HPC Chip Designs Will Be Multi-Die in 2025 By Shekhar Kapoor, Michael Posner Tags: Multi-Die System, Chip Design Insights, Design, 3DIC Compiler
BLOG 2 min read/Dec 05, 2024 BLOG Collaboration for Innovation: How 草榴社区 and TSMC are Advancing Chip Design By Sween Kang Tags: Multi-Die System, Chip Design Insights, Design, Manufacturing, Foundation IP, HPC, Data Center, Silicon IP, 3DIC Compiler
BLOG 5 min read/Jun 12, 2024 BLOG GUC Leverages 3DIC Compiler to Enable 2.5D/3D Multi-Die Package By 草榴社区 Editorial Staff, WeiHsun Liao Tags: Customer Spotlight, Multi-Die System, Chip Design Insights, Design, 3DIC Compiler
BLOG 6 min read/Jan 03, 2023 BLOG 3 Key Technologies that Will Transform Electronic Design in 2023 By Sanjay Bali Tags: Cloud, Multi-Die System, Silicon Lifecycle Management, Chip Design Insights, Design, 3DIC Compiler
BLOG 5 min read/Jul 11, 2022 BLOG What is a SmartNIC? By Rita Horner Tags: Multi-Die System, AI & Machine Learning, Chip Design Insights, Design, Security IP, Foundation IP, HPC, Data Center, Silicon IP, Verification, 3DIC Compiler
BLOG 6 min read/Feb 16, 2022 BLOG How to Design SoCs for the SysMoore Era? By Dr. Ming Zhang Tags: Multi-Die System, AI & Machine Learning, Chip Design Insights, Design, 3DIC Compiler
BLOG 8 min read/Nov 08, 2021 BLOG What is Quantum Computing? - Applications & Challenges? By Kenneth Larsen Tags: AI & Machine Learning, Chip Design Insights, Design, Photonic, Optical, 3DIC Compiler
BLOG 3 min read/Oct 11, 2021 BLOG 2021 ERI Summit & Microsystems Technology Office Symposium? By Ian Land Tags: Aerospace & Government, Silicon Lifecycle Management, Chip Design Insights, Design, Design Technology Co-Optimization, Silicon IP, 3DIC Compiler
BLOG 5 min read/Sep 29, 2021 BLOG Hyper-Convergent Chip Design Tools Power SoC Innovation? By Shekhar Kapoor, Mark Richards Tags: Chip Design Insights, Design, 3DIC Compiler
BLOG 5 min read/Mar 03, 2021 BLOG How 3DIC Design Tools Enhance Productivity & Performance? By Shekhar Kapoor, Kenneth Larsen Tags: Multi-Die System, Chip Design Insights, Design, 3DIC Compiler
BLOG 4 min read/Oct 20, 2020 BLOG Defining the AI Era with the IBM Research AI Hardware Center? By Arun Venkatachar Tags: Multi-Die System, AI & Machine Learning, Emulation, Interface IP, Virtual Prototyping, Chip Design Insights, Design, Manufacturing, Design Technology Co-Optimization, Processor 草榴社区, Silicon IP, Verification, 3DIC Compiler