Jun 13, 2023/4 min read 草榴社区 and AMD Collaboration Achieves Significant Milestones for EDA Workloads By Andy Tai, Ramesh Narayanaswamy Tags: Multi-Die System, Chip Design Insights, Design, Physical Implementation, Signoff, HPC, Data Center, Verification
Mar 20, 2022/4 min read Boosting EDA Workloads with 3rd Gen AMD EPYC? Processors? By Ramesh Narayanaswamy Tags: Customer Spotlight, Debug, Chip Design Insights, Simulation, Verification