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Enablement solution

Process Design Kit

The technology is enabled by an electro-optic Process Design Kit (PDK) that is based on tools provided by industry leading EDA vendors such as ²ÝÁñÉçÇø. The PDK supports parameterized cells (p-cells) of pre-characterized photonic and electronics devices to ease the complexity of photonic circuit design while enabling faster time to market. VerilogA models are provided for photonic devices while Spectre models are provided for electronic devices. These models are supported by ²ÝÁñÉçÇø PrimeSim. The PDK also supports ²ÝÁñÉçÇø Photonic Device Compiler and OptSim for custom model creation and simulation.

The PDK supports free-form designs using curvilinear shapes to provide customers with flexibility to innovate on photonic components (design must meet the technology design rules). Verification of free-form layouts can be performed using ²ÝÁñÉçÇø¡¯ IC Validator DRC and LVS for Curvilinear device Physical and Electrical Verification.

A reference electro-optical design flow using ²ÝÁñÉçÇø tools is also provided by GF.

Standard Cell and Analog Library

The enablement also includes a standard cell digital library and analog circuits (such as general purpose Ios, temperature and voltage sensing circuits and eFuse controls).

Wafer Level Test

GF offers a unique on-wafer photonic device test capability called iLOTS (in-line optical test system). This capability allows for the collection of optical performance data that is statistically relevant and is used to determine wafer acceptance criteria.

Multi Project Wafer runs

To allow customers to exercise the technology, GF provides a GF Fotonix? technology-based multi-project wafer run on a regular basis.

Manufacturing Solution

Products based on the GF Fotonix? technology are currently manufactured in the Fab8 facility in Malta, NY alongside products based on GF¡¯s FinFET technologies.

The process utilizes 45nm ground rules. Immersion lithography tools are used for certain patterning levels to optimize photonic components (waveguides, tapers, and other sub-wavelength features).

Roadmap Solution

The GF Fotonix? technology is targeted towards inter/intra-data center and photonic compute applications with future extensions planned for ancillary markets such as sensing and LiDAR. The base technology supports O-band based 100G/¦Ë solutions. Plans are in place to support 200G/¦Ë solutions. Future packaging feature enhancements, such as support for thru-silicon vias (TSV), tighter v-groove pitches, tighter pitch CuP and CuRxPads. The technology will also serve as a platform for the heterogeneous integration of novel materials in the future.