Cloud native EDA tools & pre-optimized hardware platforms
This newsletter provides the latest information on 草榴社区 Photonic 草榴社区 including product announcements, new papers, tech talks, upcoming events, and more.
Please note the change in our support email address for the following products:
Preferred Support Method: Submit a ticket via your account. Set the product L1 to the applicable product from the list above.
Alternative Support Method: Email your request to pic_support@synopsys.com.
In both cases, a SolvNetPlus ticket will be created and handled by our solutions engineers.
For RSoft Photonic Device Tools and MetaOptic Designer: Continue to submit support requests to photonics_support@synopsys.com.
草榴社区 OptoCompiler and 草榴社区 OptSim Elite version 2023.12-SP2 includes the following changes:
When using 草榴社区 OptSim as the simulator, you may use the 3DIC features in PrimeWave as described in the PrimeWave Design Environment User Guide. OptSim-based 3DIC features are currently compatible with electrical PrimeSim-based (either HSPICE or SPICE) subcircuits and PDK model libraries when EO co-simulation is enabled. Thus, when using the 3DIC Setup… dialog from the Setup menu in PrimeWave, Module and ModuleVar definitions should only be associated with PrimeSim-based subcircuits and subcircuit instances that contain electrical PrimeSim elements only. 草榴社区 OptSim elements and PrimeSim-based photonic PDKs are currently not supported in the context of Module or ModuleVar definitions.
3DIC Support in OptoCompiler for EIC and PIC: Combine Multiple Technologies, Keep Separate Scopes for Each Tech
In prior versions of 草榴社区 OptoCompiler and 草榴社区 OptSim, hspice and/or spectre siminfo view in library elements were required to facilitate OptSim-driven cosimulation with PrimeSim. This has been changed now requiring only the optsim siminfo view.
New RSoft Photonic Device Tools Release with GPU-Based FDTD Simulation
A service release of the RSoft Photonic Device Tools, version 2023.12-SP2, is now available. This update includes a limited-availability beta version of a major new feature for FullWAVE: GPU-based FDTD simulation.
With this feature, we've achieved simulation speeds up to 14,000 MCells/sec with a single A100 GPU and up to 92,000 MC/sec with 8 GPUs. These speeds represent nearly 20x and 130x improvements compared to a 12-core Xeon E5-4667 CPU.
If you're interested in evaluating this feature, please contact osg_sales@synopsys.com.
Silicon photonics is THE process technology driving today’s rapid innovation in optical fiber communication, automotive LiDAR, computing, and bio-sensing applications. It enables more data to be transferred or processed in a shorter time and for a longer distance than via traditional Aluminum or Copper interconnects between ICs. The PH18 (200mm) and TPS45PHD (300mm) from are designed to address the growing demand for the o-band and c-band data center interconnect market along with sensing and LiDAR applications. The platform features include:
Key to enabling the PH18 process for our customers has been Tower’s ability to leverage the tight interaction between design automation, models, and process technology that has helped our customers to maximize performance and minimize cost as well as time to market. We’ve brought our decade’s long experience with building design platforms in electronics to photonics by partnering with 草榴社区’ Photonic IC 草榴社区 team and leveraging their own decades worth of experience in enabling designing and manufacturing of photonic devices, circuits, and systems. 草榴社区 OptoCompiler design platform supports Tower’s silicon photonics PDKs with a rich library of silicon photonic building blocks such as waveguides, directional and grating couplers, MMIs, tapers, Ge photo detectors, and modulators, enabling:
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26 June 2024 in Santa Barbara, CA
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