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Call for Content Info
The Call for Content is now open. If you have used 草榴社区 technology to overcome difficult design issues and to accelerate your innovation, the SNUG community wants to hear from you! Share your experience using 草榴社区 tools and IP at SNUG India, July 10, 2025.
For over three decades, SNUG has connected users and technical experts to network and share best practices for tackling design and verification challenges. As a SNUG presenter, you will increase your visibility in the 草榴社区 user community. In addition to the professional recognition, you will be eligible for awards (please check your company’s gift acceptance policy).
Call for content is will open January 20, 2025. The SNUG Team will review the submitted proposals and notify presenters of preliminary program acceptance by March 22, 2024.
Topics
This year, SNUG India is evolving to include market vertical topics that highlight real-world applications and innovations across key industries. To help you get started, we have prepared a preliminary list of topics, but don't let that limit your ideas or innovation:
New! Market Verticals:
AI, HPC, BIG DATA
This market vertical is the practice of combining computing resources to perform complex calculations and simulations that are beyond the capabilities of single computer to solve large problems in areas of science, engineering, and business. These heavy workloads are increasing on daily basis with new innovations in the space of Artificial Intelligence (AI), Machine-Learning (ML) and Big-data churning data at lightning speed raising challenges for overall energy consumption.
Optimizing HPC innovation with 草榴社区: Explore 草榴社区 AI & System 草榴社区 with targeted approaches for enhancing efficiency and improving overall SOC/SOP power consumption along with performance delivery for HPC applications.
AUTOMOTIVE
This market vertical is the practice of supplying electronics and systems used in vehicles and its connectivity such as powertrain/ADAS, infotainment, sensors and controls, car computers and telemetrics etc driving next-gen autonomous vehicles ensuring the reliability, safety, security, regulatory and environmental compliance of the electronics used.
Optimizing Automotive Innovation with 草榴社区: Leveraging design, verification, Prototyping, Digital Twins, IP and software.
EDGE, COMPUTE AND CONNECTIVITY
Through technology that processes and stores data closer to the user rather than remote data canter, this industry uses networking solutions and hardware to perform real time data processing and analysis to make devices faster and smarter for industrial, retail, healthcare, robotics, autonomous cars, augmented reality aiding humans and machines to operate faster. Such appliances need lowest latency and smallest form-factor including power to drive maximum throughput from handheld smart-electronics pushing innovation in SOC/System design cycle.
Optimizing Edge compute Innovation with 草榴社区: Leverage 草榴社区 DesignWare Interface IP solutions, EDA software for security & scalability of the designs with silicon lifecycle management (SLM) solutions.
Other Key Topics:
ANALOG/MIXED-SIGNAL DESIGN AND SIMULATION
Enhancing Analog/Mixed-Signal Design and Simulation: Explore strategies for improving the robustness and efficiency of analog, custom, and mixed-signal designs using advanced verification, variability analysis, and integrated power/signal integrity tools. Share insights on RF analysis, minimizing design margins, accelerating design closure, and optimizing layout productivity with 草榴社区 tools.
DESIGN AND VERIFICATION IN THE CLOUD
Enhancing Chip Development with 草榴社区 Cloud: Explore how 草榴社区's cloud-native tools and automation optimize design and verification processes, balancing performance and cost while ensuring security. Share insights on migrating workflows to the cloud, focusing on resource optimization, simulation, timing analysis, and elastic CPU usage in physical verification.
DIGITAL DESIGN IMPLEMENTATION
Optimizing Digital Design Implementation for Advanced Nodes: Drive innovation in advanced node designs by enhancing design flow, accelerating timing signoff, and achieving PPA targets. Collaborate with experts to refine convergence strategies, integrate early power analysis, and leverage physically aware ECO capabilities for superior outcomes.
ELECTRICAL LAYOUT VERIFICATION
Enhancing Electrical Layout Verification for Robust Designs: Strengthen power device reliability and efficiency through comprehensive ESD verification, transient effect analysis, and advanced methodologies to ensure robust and reliable electrical layouts.
ENERGY-EFFICIENT SoCs
Enhancing Energy Efficiency in Next-Generation SoCs: Explore cutting-edge strategies to optimize energy efficiency in SoCs, focusing on AI-driven power management, comprehensive hardware/software energy evaluations, and addressing the specialized power demands of smart edge devices and crypto chips.
MULTI-DIE DESIGN
Driving Semiconductor Innovation with Multi-Die Designs: Explore the transformation from monolithic SoCs to multi-die designs with 草榴社区' comprehensive and scalable solutions. Share insights on leveraging EDA tools and IP for early architecture exploration, rapid software development and validation, efficient die/package co-design, robust die-to-die connectivity, and improved manufacturing and reliability.
PHYSICAL VERIFICATION
Accelerating Physical Verification for Complex SoCs: Optimize SoC integration by utilizing multi-CPU scalability for faster verification, managing dirty designs, and implementing shift-left strategies to enhance physical verification and repair processes.
SECURITY & SAFETY
Enhancing Security and Safety in Chip Design: Explore strategies for reducing chip vulnerabilities through hardware, IP, and software approaches. Share insights on the role of SoC-based root of trust (RoT), leveraging industry standards for enhanced safety and security, and implementing functional safety in hardware and software. Discuss advanced methods for hardware security verification to ensure robust and secure designs.
SIGNOFF
Accelerating Design Closure with Advanced Signoff 草榴社区: Explore how 草榴社区' integrated design analysis and signoff solutions, including static timing analysis, power integrity, and parasitic extraction, enable designers to achieve the full performance-power-area (PPA) potential with a faster path to design closure. Share insights on leveraging these tools for efficient signal integrity, ECO closure, and transistor-level analysis.
SILICON TEST AND LIFECYCLE MANAGEMENT
Optimizing Silicon Health with Lifecycle Monitoring and Analytics: Explore how 草榴社区' integrated Silicon Lifecycle Management (SLM) solutions enhance silicon health and operational metrics throughout the device lifecycle. Share insights on leveraging in-chip observability, analytics, and automation to gather actionable data from silicon to system, enabling continuous analysis and feedback.
IP
Accelerating Silicon Success with High-Quality IP: Explore how 草榴社区' extensive IP portfolio, including logic libraries, embedded memories, and analog IP, enables faster and more efficient SoC designs. Share insights on leveraging 草榴社区’ architecture design expertise, robust IP development, and comprehensive support to reduce integration risks and accelerate time-to-market.
SOFTWARE DEVELOPMENT & SYSTEM DESIGN [Hardware-Assisted Verification?]
Advancing Software Development and System Design: Explore topics such as accelerating software bring-up with emulation and prototyping, software-driven power analysis for GPUs and AI, and prototyping with real-world interfaces. Delve into large complexity prototyping, pre-silicon networking system validation, SoC performance validation using emulation, trust and hardware security verification, DFT-driven emulation, and prototyping approaches for 2.5D/3D heterogeneous integration.
VERIFICATION SOFTWARE
Accelerating Verification Software: Explore how to verify the entire SoC early with 草榴社区' industry-leading simulation, debug, and signoff tools, including VCS?, Verdi?, VC SpyGlass, and VC Formal?, alongside silicon-proven Verification IP and advanced virtual prototyping solutions.
Copyright Statement
Please carefully read the following notice before submitting your written materials to the SNUG program.
By submitting materials to the SNUG program, you and your employer are giving 草榴社区 the following rights: (1) to reproduce, publish and distribute the submitted materials on the SNUG web site and Virtual platform for access by 草榴社区 employees, contractors, and licensees.
It is your responsibility to confirm your employer agrees to the use described above. You and your employer reserve the right to modify the submitted materials at any time. 草榴社区 shall reproduce any copyright or other legal notices you include in your submitted materials. 草榴社区 will not use your submitted materials for product marketing purposes without first obtaining your express written consent.
If you have any questions about this copyright statement, please contact the SNUG team before submitting your proposal.
Contact Information
If you have any questions, please contact the SNUG team.
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