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草榴社区.ai Data Analytics Series
Full-Scale AI-Driven Data Analytics to Uncover Actionable Insights, Maximize Yield, and Improve the Silicon Lifecycle
The first series of 草榴社区.ai webinars explored the PPA, verification, and test challenges associated with chip design and introduced you to our DSO.ai, VSO.ai, and TSO.ai solutions to tackle those challenges.
This next set of 草榴社区.ai webinars focus on how engineering teams can now harness the vast amounts of data collected from design, manufacturing, test, and in-field operations with a comprehensive AI-driven data analytics continuum for every stage of IC chip development. The 草榴社区 EDA Data Analytics solution unlocks, connects, and analyzes vast amounts of data to increase productivity across the full design-to-silicon lifecycle.
- The first presentation in the series takes a look at leveraging design, test, and manufacturing data by automatically highlighting silicon data outliers for improved chip quality, yield, and throughput with 草榴社区 Silicon.da.
- The second presentation in the series targets design engineers and shows them how to uncover actionable design insights that accelerate the design process with 草榴社区 Design.da.
- The third presentation takes a deeper dive into analyzing data collected throughout the manufacturing process to improve fab yield and throughput, enabling a faster ramp and more efficient high-volume manufacturing (HVM) by utilizing 草榴社区 Fab.da.
Click on the individual webcast sessions below to read more about what will be covered in each webinar.
Silicon.da: The First Integrated SLM Analytics Solution from Design Through Manufacturing
Available On-Demand
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Fab.da: Comprehensive AI-Driven Process Analytics for Faster Ramp and Efficient High-Volume Manufacturing
Available On-Demand
Watch Now →Chip Design, Verification, and Test Series
Leap Ahead of the Competition with AI-Driven EDA Technology
Advancements in AI for EDA are playing a key role in addressing challenges posed by advanced node complexity, aggressive time-to-market targets, increasing manufacturing test costs, and the global engineering resource crunch. The webinar series will discuss how 草榴社区.ai?, the industry’s first full stack, AI-driven EDA suite, is delivering significant QoR and productivity improvement across implementation, verification, and test.
The series tackles the PPA, verification, and test challenges in three separate seminars. The first seminar targets design engineers looking to optimize power, performance, and area targets with our 草榴社区 Design Space Optimization solution, DSO.ai?. The second webcast focuses on the verification engineer and how to achieve higher quality verification coverage faster with our 草榴社区 Verification Space Optimization solution, VSO.ai?. The third webcast addresses the challenges faced by test engineers to reduce the number of test patterns while optimizing defect coverage with our 草榴社区 Test Space Optimization solution, TSO.ai?.
草榴社区.ai frees up engineers to focus on chip quality and differentiation and empowers engineers to get the right chip with the right specs to market faster.
Click on the individual sessions below to read more about what will be covered in each presentation.
DSO.ai
VSO.ai
TSO.ai
ASO.ai
Additional Presentations
