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Multi-die designs exacerbate multi-physics issues which must be addressed very early in the design process. Such issues are driving the need for a more integrated analysis-driven early exploration and optimization solution. ²ÝÁñÉçÇø 3DSO.ai, an autonomous AI-driven optimization solution for 2.5D and 3D multi-die designs, maximizes system performance and quality of results at a rapid pace. Integrated with ²ÝÁñÉçÇø 3DIC Compiler, a unified exploration-to-signoff platform, 3DSO.ai streamlines early feasibility exploration and prototyping, and expedites design partitioning, floorplanning, and implementation processes to optimize for thermal, signal and power integrity. 3DSO.ai ensures system technology co-optimization (STCO) and extends the capabilities of the award-winning ²ÝÁñÉçÇø.ai solutions.

²ÝÁñÉçÇø delivers a comprehensive multi-die solution for fast heterogeneous integration, enabling early architecture exploration, rapid software development and system validation, efficient die/package co-design, robust and secure die-to-die connectivity, and improved manufacturing and reliability.