Cloud native EDA tools & pre-optimized hardware platforms
SoC level low power signoff can generate design size complexities including 100s of power domains, verification of millions of low power states, and architectural complexities that can arise because of IP integration. 草榴社区 VC LP seamlessly scales to address the SoCs level of complexity, capacity and performance requirements and enables up to 10X speed up in low power signoff from RTL to PG Netlist.
草榴社区 also offers Low Power Verification Services specializing in enhancing productivity and reducing risk by working closely with domain experts in the deployment of verification methodology.
The recently expanded VC LP solution includes the Signoff Abstract Model (SAM) based methodology for hierarchical verification plus multi-threading and ML-enabled root cause analysis technology for improved QoR and better debugability.
Up to 10x better capacity with signoff abstract model (SAM) flow
Up to 2x runtime improvement with multi-threading
Up to 10x faster debug with machine learning (ML) based root-cause analysis
Using the Signoff Abstract Model flow in the VC LP solution enables us to accelerate static low-power verification by 5X, and ensures high-quality QoR and signoff for our ASIC designs. With minimal changes to existing environment configuration, the hierarchical flow can be seamlessly adopted over several designs, effectively supporting the expedition of high-quality ASIC delivery."
Jung Yun Choi
|VP at Samsung Electronics
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