草榴社区

Call for Content Info

Call for Content is now closed. If you have used 草榴社区 technology to overcome difficult design issues and to accelerate your innovation, the SNUG community wants to hear from you! Share your experience using 草榴社区 tools and IP at SNUG Europe, 草榴社区 Users Group (SNUG), June 10-11, 2024. 

 

For over three decades, SNUG has connected users and technical experts to network and share best practices for tackling design and verification challenges. This past year was a major pivot in how all of us live, work, and connect to each other. As a SNUG presenter, you will increase your visibility in the 草榴社区 user community. In addition to the professional recognition, you will be eligible for awards (please check your company’s gift acceptance policy).

The call for content is now closed. The SNUG Team will review the submitted proposals & notify presenters of preliminary program acceptance from February 26, 2024.

Topics

We have a preliminary list of topics to get you started, but don't let that limit your ideas or innovation:

AI AND MACHINE LEARNING

  • Improving productivity and achieving faster quality of results with AI and machine learning 
  • Using implementation tools to enable the highest-performance AI designs
  • Formal verification of data path designs 
  • Using emulation for AI software stack validation
  • Productivity and performance innovations using AI-driven EDA tools
  • Using AI-ready IP to meet processing, memory, and connectivity requirements for deep learning applications 
  • The challenges of designing and integrating AI accelerators
  • Using AI to enable rapid analog and digital node migration

AUTOMOTIVE

  • Accelerating automotive software development and validation with virtual prototyping
  • End-to-end functional safety verification with fault simulation, formal and static verification
  • High-reliability design techniques for automotive designs
  • Implementing safety-critical designs for automotive applications
  • Designing ISO 26262 required in-system test using 草榴社区 tools
  • Accelerating ISO 26262 certification with ASIL-ready certified IP

 

ANALOG MIXED SIGNAL DESIGN AND SIMULATION

  • Addressing analog, custom digital or memory design verification turnaround time bottlenecks with heterogenous compute acceleration
  • RF analysis of RFIC or analog periodic circuits
  • Ensuring AMS design robustness with advanced variability analysis
  • Minimizing design margins with integrated power/signal net electromigration/IR drop analysis
  • Improving AMS design robustness with analog circuit electrical rule checking
  • Best practices in mixed-signal verification with a digital verification methodology 
  • Verifying power and signal integrity for multi-gigabit circuits
  • Accelerating pre-layout design centering & optimization
  • Custom layout productivity gains using 草榴社区 tools
  • Mixed custom/digital implementation productivity gains using 草榴社区 tools 
  • Accelerating analog design closure
  • Accelerating mixed-signal verification using behavioral models of analog circuits (i.e. SystemVerilog real number modeling)

BIG DATA ANALYTICS

  • Accelerating root cause analysis with AI-driven data analytics
  • Using analytics to optimize power, performance, and area targets
  • Using analytics to understand the ecosystem health and silicon life cycle management

DESIGN AND VERIFICATION IN THE CLOUD

  • Performance vs. cost trade-offs for design or verification in a cloud environment
  • Security concerns and best practices in migrating from on-premises to cloud for design and verification
  • Allocation and usage of cloud resources for library characterization, simulation, timing analysis and parasitic extraction
  • Maximizing available resources with physical verification elastic CPU usage
  • Impacts on design size partition for physical implementation in a cloud environment
  • Exploring the impact on design size partition using physical implementation in a cloud environment 
  • Leveraging tool runtime scalability in the cloud; what worked best 

DIGITAL DESIGN IMPLEMENTATION

  • Optimal design flow for digital implementation at advanced node designs 
  • Advanced place & route to meet PPA targets 
  • Accelerating time to results for large designs 
  • Shift left convergence by improving constraints and RTL restructuring 
  • How to achieve optimized performance, power and area for Arm CPUs
  • Using parallel processing to accelerate physical and full-chip timing signoff
  • Accelerating full-chip turnaround time for large designs using physical signoff 
  • Early time-based peak power analysis using RTL-based vectors 
  • Using physically aware ECO capabilities to improve PPA and accelerate timing closure
  • Timing constraint creation, propagation and verification
  • How constraint promotion accelerates SOC integration and signoff

ELECTRICAL LAYOUT VERIFICATION

  • Full-chip ESD verification
  • Transient ESD effects
  • Power device reliability
  • Improving power device efficiency

ENERGY-EFFICIENT SoCs

  • Low-power design for smart edge devices
  • AI-driven power considerations
  • The quest for energy efficiency: evaluating hardware and software approaches
  • Transistor-level vs. system-level energy optimization
  • The special power demands of crypto chips

MULTI-DIE SYSTEM

  • Advances in multi-die systems
  • Planning, Integrating and signoff methodologies for 2.5/3D integrated circuits

MEMORY

Design Technology Co-optimization:

  • Memory technology exploration (novel devices, process recipes) with TCAD and SPICE
  • Memory technology pathfinding with virtual PDKs
  • Faster design closure with In-design lithography rule checking 

Design Shift Left:

  • Faster block/chip-level simulation TAT
  • Faster PDN simulation with heterogenous compute (CPU + GPU) acceleration
  • ML-driven high sigma Monte Carlo analysis for library characterization
  • Faster physical verification on memory designs with ML-driven scheduling and distributed processing
  • Faster design closure with pre-layout parasitic estimation

Digitization:

  • Mixed-signal verification flows for memory data path
  • Static timing analysis for embedded memories
  • Timing robustness with MOS aging-aware static timing analysis
  • Automated place & route for memory periphery

Silicon Reliability:

  • Higher coverage with circuit electrical rule checking
  • Fast chip-level EM/IR analysis w/ PDN
  • Functional safety analysis and ISO 26262 compliance for memory IP with analog defect simulation
  • Analog test coverage improvement with analog defect simulation
  • Faster silicon failure analysis with analog defect simulation
  • Silicon lifecycle management for memory IP
  • Memory protocol verification and coverage closure

PHYSICAL VERIFICATION

  • Leveraging multi-CPU scalability for fast time-to-results 
  • Dirty design handling during SoC integration to minimize runtime and maximize productivity 
  • Shift-left physical verification analysis and repair  

SECURITY & SAFETY

  • Strategies to reduce chip vulnerabilities through hardware, IP or software approaches 
  • The role of an SoC-based root of trust (RoT) for security 
  • How to leverage standards to enhance safety and security 
  • Hardware and software approaches to implementing functional safety 
  • Hardware security verification 

SIGNOFF

  • How 3DIC design changes signoff
  • AI algorithms and their impact on signoff
  • Balancing timing, power, power/signal integrity closure

SILICON TEST AND LIFECYCLE MANAGEMENT

  • Success with early RTL analysis, physically aware and area-saving DFT, higher defect detection, lower pattern count/test time, faster and volume diagnostics
  • Use of software analytics for accelerating product introduction as well as improving yield, test times and quality during high-volume production
  • Highlighted SoC application areas include AI, automotive, mobile and processors
  • Integration of PVT sensor IP monitors and subsystems for enhanced device screening, power and performance optimization, and enhanced field performance/security 

SUCCESSFUL IP INTEGRATION INTO SoCs

  • Interface IP such as 112G Ethernet, Die-to-Die, PCIe 5.0, DDR5/LPDDR5, etc.
  • Embedded ARC processors & embedded vision processors
  • OTP NVM, embedded memories & logic libraries in advanced FinFET processes
  • Integration of IP into high-performance computing, automotive, AI/ML or IoT designs

VERIFICATION HARDWARE

  • Accelerating software bring-up with emulation and prototyping
  • Software-driven power analysis for GPUs and AI
  • Prototyping with real-world interfaces
  • Large complexity prototyping
  • Pre-silicon networking system validation
  • SoC performance validation using emulation
  • Trust and hardware security verification
  • DFT-driven emulation
  • Prototyping approaches for 2.5D/3D heterogeneous integration
  • The use of digital twins

VERIFICATION SOFTWARE

  • Faster and better convergence using formal methods
  • Verification coverage planning and closure
  • Best practices for static verification (Lint/CDC/RDC/SDC/LP) signoff
  • Accelerating verification and debug for advanced protocols
  • Innovations in verification methodology for optimized performance

Copyright Statement

Please carefully read the following notice before submitting your written materials to the SNUG program.

By submitting materials to the SNUG program, you and your employer are giving 草榴社区 the following rights: to reproduce, publish and distribute the submitted materials on the SNUG web site and virtual platform for access by 草榴社区 employees, contractors, and licensees.

It is your responsibility to confirm your employer agrees to the use described above. You and your employer reserve the right to modify the submitted materials at any time. 草榴社区 shall reproduce any copyright or other legal notices you include in your submitted materials. 草榴社区 will not use your submitted materials for product marketing purposes without first obtaining your express written consent.

If you have any questions about this copyright statement, please contact the SNUG team before submitting your proposal.

Contact Information

If you have any questions, please contact the SNUG team

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