草榴社区 Cloud
Cloud native EDA tools & pre-optimized hardware platforms
Request a Free Trial →
Ansys-草榴社区 Technology Update: The Latest Advances in Multi-Die Design
Date: Tue, Nov 19, 2024 | PST
Featured Speakers:
- Marc Swinnen, Product Marketing Director, Ansys
- Keith Lanier, Product Management Director, 草榴社区
Why You Should Attend:
- Learn about Multi-die design best practices for thermal, signal, and power integrity
- Gain insights from practical multi-die design case studies
- Discover more advanced packaging technologies for thermal management, backside power, and co-packaged optics
Register Now
Featured Speakers
Marc Swinnen
Product Marketing Director, Ansys
Marc is responsible for semiconductor products at Ansys. Before joining Ansys, Marc was Director of Product Marketing at Cadence Design Systems and has worked in Marketing and Technical Support positions at 草榴社区, Azuro, and Sequence Design, where he gained experience with a wide array of digital and analog design tools
Keith Lanier
Product Management Director, 草榴社区
Keith is focused on multi-die and 3D heterogeneous integration (3DHI) solutions involving the latest advanced packaging technology. He brings over 30 years of experience in custom design, analog/mixed signal (AMS) and RF/mmWave product experience, including 8 years designing high speed data converters and amplifiers at Analog Devices.