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This year's event brought together 草榴社区’ Digital Design Technical Symposium and Verification Day into a single event - 草榴社区 Silicon Realization TechSummit. Participants from Arm, Broadcom, Datapelago, Deca Technologies, Intel, Microsoft, NVIDIA, NXP, Samsung, SiFive, Stanford University, 草榴社区 and Ventana Micro shared their insights on three of the hottest industry topics right now; The Move to Multi-Die, Energy Efficient Design and Reliability, Resiliency, Security.
The Move to Multi-Die - Panel
An Industry Perspective on the Coming of Age of Multi-die Design
Panelists:
Jayanthi Pallinti - Broadcom, Craig Bishop - Deca Technologies,
Vivek Rajan - Intel, Sooyong Kim - Samsung,
David Kruckemyer - Ventana Micro
Panel Moderator: Rob Aitken - 草榴社区
The Move to Multi-Die - 草榴社区 Presentation
New Dimensions, New Opportunities: Sparking a New Age of Innovation with Multi-Die Design
Multi-die architectures are emerging as a catalyst, sparking continued innovation and opening up new opportunities in broad market applications, including AI, high-performance computing, and mobile. This presentation will discuss the “coming of age” of multi-die design and highlight 草榴社区’ software-to-silicon system-level solution that is enabling the next wave of transformative products.
Shekhar Kapoor, Sr. Director, Product Marketing, 草榴社区
Energy Efficient Design - Panel
1000X Improvement in Energy Efficiency: What’s a chip got to do with it?
Panelists:
Anand Iyer - Datapelago, Atul Walimbe - Intel,??
Bijal Shah -?NVIDIA,?Rohit Kumar -?SiFive,?
Vishal Khandelwal -?草榴社区
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Panel Moderator:?Rob Aitken?-?草榴社区
Energy Efficient Design - 草榴社区 Presentation
A Vision for Software-Driven Energy Efficient Design
草榴社区 presents industry trends for energy efficient design, along with its vision and solutions for a ‘shift-left’ methodology. Topics include architectural tradeoffs, power profiling with real software workloads, RTL design for low power, RTL power regressions, power-driven implementation, and power signoff.
Solaiman Rahim, Group Director, R&D, 草榴社区
Reliability, Resiliency, Security - Panel
What is the Cure for All Our Reliability, Resiliency, and Security Woes?
Panelists:
Ghani Kanawati -?Arm,?Serge Leef -?Microsoft,??
Vatsa Prahallada -?NXP,??Subhasish Mitra -?Stanford University
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Panel Moderator:?Adam Cron -?草榴社区
Reliability, Resiliency, Security - 草榴社区 Presentation
Reliable and Secure Silicon Throughout the Lifecycle
The future of silicon health management is hardware analytics and test. In this session you will learn how 草榴社区 verification, signoff and silicon lifecycle management (SLM) solutions are enabling secure, reliable, and resilient silicon.
Adam Cron, Distinguished Architect, 草榴社区
