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Space-borne electronics must operate in an unforgiving environment with harsh conditions and little opportunity to repair failing components. A combination of functionally safe design, RHBD, and robust IP is required. Fortunately, automotive applications share many of the same challenges, and techniques to address these challenges are well established and proven. This white paper surveys the main causes of chip failures in harsh environments and will present solutions to prevent these failures. You¡¯ll learn methods to:

• Address random faults methodically
• Automate insertion of hardware safety mechanisms
• Design rad-hard multi-die systems
• Apply security throughout the product lifecycle

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