础滨驱动的设计应用
先进的芯片为我们每天依赖的卓越软件提供强力支持。从智能手机、可佩戴设备、智能医疗设备，到无人驾驶汽车，芯片是一切的基础。
从基于标准的 IP 核到完整的定制架构，新思科技拥有值得信赖的 IP 核和子系统专家，能够满足您独特的芯片需求。
新思科技是全球领先的硬件加速验证和虚拟化解决方案提供商
EDA和半导体滨笔术语表
ADAS
AI Accelerator
Analog Design
Augmented Reality Optics
Automotive Exterior Lighting
Automotive Hardware Functional Safety
Automotive Interior Lighting
Automotive Safety Integrity Level
Autonomous Car
Autonomous Driving Levels
Battery Management System
Big Data Analytics
Bidrectional Scattering Distribution Function (BSDF)
Bring Your Own Cloud (BYOC)
Butterfly PUF (Physical Unclonable Function)
Circuit Simulation
Clock Domain Crossing
Cloud Access Security Broker (CASB)
Cloud Computing Infrastructure
Cloud Data Center
Cloud Migration
Cloud-Native
Cloud-Native Architecture
Cloud Security Frameworks
Cloud Storage Security
Cloud Workload Protection (CWP)
Code Linting
Common Data Model
Compute Express Link (CXL) 3.0
Counterfeit Chips
Co-Packaged Optics
Cryo-CMOS IP (Cryogenic semiconductor IP)
Custom IC
Democratized Design
Density Functional Theory
Design Rule Checking
Design Space Optimization
Design Planning
Die-to-Die Interface
Distributed Cloud Computing
Edge Computing
Edge Computing Architecture
Elasticity in Cloud Computing
Electromigration
Electronic Design Automation (EDA)
Embedded Magneto-Resistive Random Access Memory (eMRAM)
Equivalence Checking
Ethical Hacking
FDTD
FinFET
FlexEDA
Functional ECO
Glitch Power
High Bandwidth Memory 3 (HBM3)
High-Performance Computing Architecture
Hybrid Cloud Integration
Hyper Convergent Design Flow
IC Design
Integrated Development Environment (IDE)
ISO 26262
Layout Versus Schematic
Library Characterization
LiDAR
Light Guide
Light Scattering
Low Power Design
Machine-Learned Force Fields
Machine Vision Optics
MACsec Protocol
Mach-Zehnder Modulator
Medical 3D Printing
Medical Image Processing
Medical Image Segmentation
Metalens
Microservices
MISRA (Motor Industry Software Reliability Association)
Mobile Industry Processor Interface (MIPI) Protocol
Model-Based Design
Modulation Transfer Function
Moore's Law
Multi-Cloud Architecture
Multi-Cloud Infrastructure
Multi-Cloud Storage
Multi-Cloud Strategy
Multi-Die Chip Design
Multi-Die Systems
Network Attached Storage (NAS)
NFS Shared Storage
Object Storage
Parasitic Extraction
Patient-Specific Surgical Planning Software
PCIe 6.0 Specification
Persistent Storage
Pervasive Intelligence
Physical Unclonable Function (PUF)
Photonic Integrated Circuit
Photonics
Physical Synthesis
Point of Care 3D Printing
Power Electronics
Power Optimization
Process Design Kit
Programmable Electrical Rules Checking
PVT Sensors
Quantum Computing
Ray Tracing
Reflectance and Transmittance
Reinforcement Learning
Reset Domain Crossing
RISC-V
RF Circuit Design
Robustness Analysis
SerDes
Shared Cloud Storage
Silicon Lifecycle Management
Silicon Photonics
SmartNIC
SmartScaling
SRAM PUF (Static Random-Access Memory Physical Unclonable Function)
Static Timing Analysis
Stray Light
System-On-Chip (SoC)
Three-Dimensional Integrated Circuit (IC)
Total Integrated Scattering
Total Internal Reflection (TIR) Bidirectional Scattering Distribution (BSDF)
Triple Shift Left
Universal Flash Storage (UFS)
USB4
Vehicle Electrification
Virtual Prototyping
Virtual Reality Optics
Volume Scattering
Wiring Harness
3D Anatomical Models
3D Image Processing
3D Image Segmentation
3D Image Visualization
3DIC Technology
5G
5G vs 4G
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