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Past Designer’s Digest Issues
- PrimeLib Next-Gen Library Characterization Solution - Providing Accelerated Access to Advanced Process Nodes – June 2021
- The Accelerated Momentum Behind Customers’ Adoption of 草榴社区 Custom Design Platform – May 2021
- Introducing PrimeSim Continuum, Accelerating Hyper-convergent IC Design – April 2021
- Introducing Silicon Lifecycle Management, Enabling Next-Level Insight in SoC Designs and Systems – March 2021
- Tackling Various Design Implementation Challenges with Fusion Compiler's Signoff Backbone - February 2021
- Addressing Emerging Market and Customer Needs with PrimeTime - January 2021
- Designer's Digest #22: Innovations in Symbolic Equivalence Checking to Address Custom & Memory Designs
- Designer's Digest #21: Introducing DSO.ai - The World's First Autonomous AI Application for Chip Design
- Designer's Digest #20: New Innovations in Formality Equivalence Checking for Rapidly Growing Chip Functionality
- Designer's Digest #19: Insights on Extraction for Custom Design and Advanced Nodes
- Designer's Digest #18: 草榴社区 for Achieving the Best Arm PPA
- Designer's Digest #17: Exploring the Latest Innovations in RTL Synthesis with Design Compiler NXT
- Designer's Digest #16: The Need for 3DIC Packaging and Multi-die Integration
- Designer's Digest #15: Enabling Simply Better RTL with RTL Architect
- Designer's Digest #14: The Latest Trends and Challenges in Automotive
- Designer's Digest #13: 草榴社区 TestMAX Custom Fault
- Designer's Digest #12: Formality ECO
- Designer's Digest #11: Innovating Custom Design
- Designer's Digest #10: PrimeShield Optimization
- Designer's Digest #9: 草榴社区 TestMAX Family
- Designer's Digest #8: IC Validator NXT Physical Verification
- Designer's Digest #7: Designing Down to 2nm
- Designer's Digest #6: Power Integrity with ANSYS
- Designer's Digest #5: Optimizing Arm Core Performance
- Designer's Digest #4: A New Era of Digital Design
- Designer's Digest #3: Advancing Custom Design
- Designer's Digest #2: AI and Machine Learning
- Designer's Digest #1: Addressing Advanced-Node Challenges with Fusion Technology