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草榴社区 at Chiplet Summit
The era of pervasive intelligence is creating new possibilities for innovation and collaboration. 草榴社区 is driving the new era with a comprehensive and scalable multi-die system solution that accelerates heterogeneous integration. Listen to the 草榴社区 keynote and various tutorial presentations at Chiplet Summit 2024 to gain expert insights into the technologies you need to move your innovation forward.
Tutorial A
Tue. February 06, 2024
08:30 - 12:00 PM
PST
Tutorial E
Tue. February 06, 2024
01:00 - 05:00 PM
PST
Physical-Aware Architecture Optimization for Multi-Die Systems
- Holger Keding, Sr. Staff R&D Engineer, 草榴社区
Tutorial D
Tue. February 06, 2024
08:30 - 12:00 PM
PST
Efficient Monitoring, Test, and Repair of UCIe Links for Multi-Die Systems
- Yervant Zorian, Fellow, 草榴社区
- Sandeep Goel, Director, TSMC
- Panelist: Mick Posner, VP of Product Management, 草榴社区
Tutorial F
Tue. February 06, 2024
01:00 - 05:00 PM
PST
Working with New 3D IC Design Standards
- Kenneth Larsen, Director of Product Management, 草榴社区
Tutorial E
Tue. February 06, 2024
01:00 - 05:00 PM
PST
Accelerating I/O Hub and Memory Chiplet Design
- Manmeet Walia, Product Management Director, 草榴社区
- Erez Shaizaf, Chief Technical Offier, Alchip
Tutorial H
Tue. February 06, 2024
01:00 - 05:00 PM
PST
Keynote
Wed. February 07, 2024
10:50 - 11:20 AM
PST
Multi-Die Systems Set the Stage for Innovation
- Abhijeet Chakraborty, VP Engineering, 草榴社区
Track A-101
Wed. February 07, 2024
02:00 - 03:00 PM
PST
Developing Secure Multi-Die Systems
- Dana Neustadter, Director of Product Management, 草榴社区
Track B-101
Wed. February 07, 2024
02:00 - 03:00 PM
PST
UCIe Reaches a First Step in Interoperability
- Manuel Mota, Senior Product Manager, 草榴社区
- Stephen Wong, Principal Engineer, Intel
Track B-102
Wed. February 07, 2024
03:15 - 04:15 PM
PST
Multi-Die Systems for Aerospace and Defense Applications
- Kenneth Larsen, Director of Product Management, 草榴社区
Panel Track C-103
Wed. February 07, 2024
04:40 - 05:30 PM
PDT
Exhibits
Wednesday, February 7, 2024: 12:00 - 2:00 PM; 5:30 - 7:30 PM
Thursday, February 8, 2024: 12:00 – 2:00 PM
Visit the 草榴社区 booth #200 to network with our experts and see several multi-die system demonstrations for performance architecture, physical design and analysis, and UCIe & 224G IP solutions.
