草榴社区

草榴社区 XSR PHY IP

The 草榴社区 XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in multi-chip modules (MCMs) for hyperscale data center, AI, and networking applications. The low-latency, low-power, and compact PHY supports NRZ and PAM-4 signaling from 2.5G to 112G data rates and is compliant with the OIF CEI-112G and CEI-56G standards for extra-short reach (XSR) links. The XSR PHY offers a flexible layout for maximum bandwidth per die edge by allowing the placement of the square macros along all edges of the die. It deploys 16-lane transmit and receive macros for optimized segmentation on the multiple dies. The robust DLL-based clock-forwarded architecture enables high energy efficiency while supporting reliable links of up to 50 millimeters for large MCMs. The PHY enables multi-die connectivity over organic substrates, which helps reduce packaging costs without requiring advanced interposer-based packaging over shorter distances. The embedded bit error rate (BER) tester and nondestructive 2D eye monitor capability provide on-chip testability and visibility into channel performance. Besides the PMA and PMD, the PHY includes a raw PCS to facilitate the interface with the on-chip network, regardless of the existing networking protocol. The XSR IP is combined with 草榴社区’ comprehensive routing feasibility analysis, package substrate guidelines, signal and power integrity models, and crosstalk analysis for fast and reliable integration into SoCs.

Additional resources:
Glossary page: What is a Die-to-Die Interface?
Blog:

草榴社区 XSR PHY IP

 

Highlights
Products
Downloads and Documentation
  • 16-lane TX and RX square macros for placement in any edge of the die
  • Supports 2.5G to 112G data rates, enabling very high bandwidth per mm of beachfront for die-to-die and die-to-optical engine connectivity
  • Implements NRZ and PAM-4 signaling
  • Meets the performance, efficiency, and reliability requirements of die-to-die interconnects
  • Robust DLL-based, clock-forwarded architecture minimizes complexity and power dissipation
  • Linear equalization and T-Coils in RX and TX allow compliance to XSR links up to 50mm for large MCM designs
  • Low jitter phase-locked loops (PLLs) provide robust timing recovery and better jitter performance
  • Compliant with the OIF CEI-112G and CEI-56G standards for XSR links
Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to GF 12LP+ x8, North/South (vertical) poly orientationSTARs Subscribe
Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC 12FFC X16, North/South (vertical) poly orientationSTARs Subscribe
Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC 12FFC X8, North/South (vertical) poly orientationSTARs Subscribe
Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N5 X16, North/South (vertical) poly orientationSTARs Subscribe
Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N5 X8, North/South (vertical) poly orientationSTARs Subscribe
Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N6 X16, North/South (vertical) poly orientationSTARs Subscribe
Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N7 X16, North/South (vertical) poly orientationSTARs Subscribe
Description: Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to GF 12LP+ x8, North/South (vertical) poly orientation
Name: dwc_d2d_sr112_phy_gf12lpp_x8ns
Version: 1.00a
ECCN: 5E991/NLR
STARs: Open and/or Closed STARs
myDesignWare: Subscribe for Notifications
Product Type: DesignWare Cores
Documentation:
Download: dwc_d2d_sr112_phy_gf12lpp_x8ns
Product Code: F925-0
Description: Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC 12FFC X16, North/South (vertical) poly orientation
Name: dwc_d2d_sr112_phy_tsmc12ffc_x16ns
Version: 2.03a
ECCN: 5E991/NLR
STARs: Open and/or Closed STARs
myDesignWare: Subscribe for Notifications
Product Type: DesignWare Cores
Documentation:
Download: dwc_d2d_sr112_phy_tsmc12ffc_x16ns
Product Code: G561-0
Description: Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC 12FFC X8, North/South (vertical) poly orientation
Name: dwc_d2d_sr112_phy_tsmc12ffc_x8ns
Version: 2.02a
ECCN: 5E991/NLR
STARs: Open and/or Closed STARs
myDesignWare: Subscribe for Notifications
Product Type: DesignWare Cores
Documentation:
Download: dwc_d2d_sr112_phy_tsmc12ffc_x8ns
Product Code: F330-0
Description: Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N5 X16, North/South (vertical) poly orientation
Name: dwc_d2d_sr112_phy_tsmc5ff_x16ns
Version: 2.02a
ECCN: 5E991/NLR
STARs: Open and/or Closed STARs
myDesignWare: Subscribe for Notifications
Product Type: DesignWare Cores
Documentation:
Download: dwc_d2d_sr112_phy_tsmc5ff_x16ns
Product Code: E474-0
Description: Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N5 X8, North/South (vertical) poly orientation
Name: dwc_d2d_sr112_phy_tsmc5ff_x8ns
Version: 2.01a
ECCN: 5E991/NLR
STARs: Open and/or Closed STARs
myDesignWare: Subscribe for Notifications
Product Type: DesignWare Cores
Documentation:
Download: dwc_d2d_sr112_phy_tsmc5ff_x8ns
Product Code: F338-0
Description: Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N6 X16, North/South (vertical) poly orientation
Name: dwc_d2d_sr112_phy_tsmc6ff_x16ns
Version: 2.00a
ECCN: 5E991/NLR
STARs: Open and/or Closed STARs
myDesignWare: Subscribe for Notifications
Product Type: DesignWare Cores
Documentation:
Download: dwc_d2d_sr112_phy_tsmc6ff_x16ns
Product Code: F335-0
Description: Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N7 X16, North/South (vertical) poly orientation
Name: dwc_d2d_sr112_phy_tsmc7ff_x16ns
Version: 2.01a
ECCN: 5E991/NLR
STARs: Open and/or Closed STARs
myDesignWare: Subscribe for Notifications
Product Type: DesignWare Cores
Documentation:
Download: dwc_d2d_sr112_phy_tsmc7ff_x16ns
Product Code: E829-0